铂悦仪器(上海)有限公司

您当前的所在位置为:首页>产品中心>电学特征>电学特性
相关文章

电学特性

更新时间:2023-03-28

产品品牌:

产品型号:

产品描述:

电学特性

FEOL Electrical Characterization
In IC device manufacturing electrical characteristics of layers and films must be well controlled. Conventional contact test methods on monitor wafers, like the 4-point probe FSM offers, do no longer meet modern requirements. State of the art IC feature extremely thin, often only a few atomic layers of material. FSM's contactless RsL probe for sheet resistance and leakage as well as the non-destructive EOT probe for IC-CV measurements meet the challenge to characterize ultra shallow junctions and thin dielectric materials on production wafers.

FSM offers contact and non-contact electrical characterization metrology used in FEOL device making.

 

 

3DIC TSV and BWS TTV硅片表面形貌测量
Film Stress薄膜应力量测仪
FEOL Electrical Characterization 电学特性
Thin wafer metrology 晶圆测量学
Film Adhesion漆膜附着力测试

FSM offers contact and non-contact electrical characterization metrology used in FEOL device making.

在线留言
联系我们

电话:86-021-37018108

传真:86-021-57656381

邮箱:info@boyuesh.com

地址:上海市松江区莘砖公路518号松江高科技园区28幢301室

Copyright © 2013 铂悦仪器(上海)有限公司 版权所有 备案号:沪ICP备10038023号-1

沪公网安备 31011702008990号